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The Latest Breaking News from SK Hynix

Western Digital is preparing 40TB Ultra SMR hard drive as race to first 50TB HDD heats up

CEO confirms that company has a clear roadmap into the 40TB range but didn’t provide with a timeline

TechRadar

Western Digital to Split HDD and NAND Businesses

Western Digital has announced its decision to split its hard disk drive and NAND memory businesses, creating two separate public companies. According to the company, the change is aimed at refining the focus and operational efficiency of each business segment. The separation, planned to be tax-free, is slated for completion…

AnandTech

Samsung narrows its semiconductor losses, giving hope that the chip slump is nearing a turning point

Demand for consumer electronics like smartphones and PCs may be stabilizing after a post-COVID plunge.

Fortune

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Solidigm Lays Off Employees Due to Industry Downturn

The solid state storage industry has been in a well-documented slide for the better part of the last year now. With storage product demand from both the client and datacenter businesses down well off of its highs in a notoriously cyclical business, we've already seen the big three memory manufacturers…

AnandTech

Micron and SK hynix Ship LPDDR5-9600 Memory for Next-Gen Smartphones

Fast memory is crucial for the performance of high-end system-on-chips that are getting more sophisticated every year. When it comes to smartphones, the most obvious way to boost memory performance is to push its data transfer rate. Apparently, this is what Micron and SK Hynix are doing with their new…

AnandTech

How TSMC and other firms making the most advanced semiconductors are getting a reprieve from Biden's chip war on China

TSMC is the third chipmaker to get a U.S. waiver to supply equipment to factories in China, following Korean firms Samsung and SK hynix.

Fortune

HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface

High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1 GT/s (the original HBM) and reaching upwards of 9 GT/s with the forthcoming HBM3E. This has made for an impressive jump…

AnandTech

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TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips

This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better build innovative chips in an efficient and timely manner. The OIP program has grown over the years and now involves tens…

AnandTech

Micron to Ship HBM3E Memory to NVIDIA in Early 2024

Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for the new RAM. Meanwhile, the company stressed that its new product has been received with great interest by the industry at…

AnandTech

Will U.S.-China Tech Squabbles Threaten Tech Stocks?

Several mega-cap technology stocks and suppliers to Apple (AAPL ) tumbled last week after the Chinese government banned iPhones from government-backed agencies and state companies, thereby threatening iPhone sales. Also, suppliers to Huawei Technologies came under pressure last week, with some U.S. lawmakers calling for a halt to all U.S....

Barchart

Nvidia Could Use Samsung's GDDR7 Chips for GeForce RTX 50-Series

Nvidia is reportedly evaluating Samsung's GDDR7 chips with its next-generation GPUs.

Tom’s Hardware

SK Hynix Samples 9 GT/s HBM3E: Up to 1.15 TB/s per Stack

SK Hynix's 9 GT/s HBM3E set to arrive during the first half of 2024.

Tom’s Hardware

Samsung to Produce 300-Layer V-NAND in 2024: Report

Samsung to use double-stack architecture for 300-layer 3D V-NAND memory, according to a leak.

Tom’s Hardware

Here’s the chip that could make 100TB SSDs mainstream in 2024 but you won’t be able to use them

SK Hynix demos 321-layer 4D NAND at Flash Memory Summit just weeks after 238-layer parts went in mass production.

TechRadar

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Tom’s Hardware

AI Boom Sees Memory Makers Ramp Up HBM Memory Production: Report

Bit shipments of HBM memory set to grow by 105% by 2024, TrendForce claims.

Tom’s Hardware

SK Hynix Demonstrates 321-Layer TLC NAND Memory

SK Hynix aims to produce 321-layer TLC NAND in 1H 2025.

Tom’s Hardware

SK Hynix Sees DRAM Market Recovery Due to AI Servers

SK Hynix says demand for HBM and DDR5 memory drives revenue growth.

Tom’s Hardware

Micron's New HBM3 Gen2 is World's Fastest at 1.2 TB/s, Teases Next-Gen at 2 TB/s+

Micron announced that its HBM3 Gen2 memory, which is the Fastest, densest and most power efficient yet, is now sampling to its partners.

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Tom’s Hardware

SK Hynix Enters Portable SSD Market With Beetle X31

SK Hynix enters the consumer external SSD fray with the Beetle X31 which is cased in aluminum and offers good sustained performance.

Tom’s Hardware

SK Hynix 48 GB SODIMMs Hit Retail in China

SK hynix 48 GB DDR5 SODIMM modules hit Taobao in China, with the modules priced at about $165.

Tom’s Hardware

Nvidia Reportedly Interested in Using SK Hynix HBM3E Memory

SK Hynix to supply HBM3E samples to Nvidia for evaluation.

Tom’s Hardware

U.S. to Let Samsung, SK Hynix, TSMC Expand Fabs in China: Report

U.S. set to allow South Korean and Taiwanese companies to upgrade fab operations in China using American wafer fab tools.

Tom’s Hardware

SK hynix Starts Mass Production of Speedy, 238-Layer NAND

The new memory promises speeds of up to 2,400 MT/s, which is necessary for the fastest SSDs.

Tom’s Hardware

SK Hynix Preps HBM3E Memory: A 25% Speed Boost Over HBM3

SK Hynix readies 8 GT/s HBM3e memory for AI and HPC applications.

Al Jazeera

China bars operators from buying chips from US tech firm Micron

China bans US chipmaker Micron days after the G7 members launched veiled criticism of China’s trade practices.

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