The Latest Breaking News from SK Hynix

The Biden administration is allocating $75 million of CHIPS Act funding to Absolics to build a plant for glass semiconductor substrates in Georgia. Glass substrates are the next major step forward in semiconductor fabrication.

Samsung's HBM3E reportedly consumes too much power and overheats, so Nvidia does not plan to use them for now.

Samsung Electronics has named Young Hyun Jun its new Head of Device Solutions, apparently to strengthen Samsung's competitiveness in the industry, with his predecessor off to focus on future moves and vision.

TSMC to use 12FFC+ and N5 process technologies to build base dies for HBM4.

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are…

Samsung's chief rival SK Hynix has developed a next-generation mobile NAND called ZUFS 4.0.

Samsung and SK hynix are reportedly finally halting DDR3 production this year. The extreme demand for HBM3 memory has memory manufacturers closing down old fabs to focus on newer tech, thanks to the AI boom.

SK hynix is the fifth organization to be raided by South Korea's watchdog group as part of its investigation into alleged securities fraud on the part of SSD and controller manufacturer Fadu.

Samsung has announced plans to focus on producing HBM, DDR5 and SSDs for the enterprise market.

SK Hynix reportedly says 3D NAND chipmaking goes subzero as higher flash memory stacks must be produced at -70C temps.

South Korean memory giant SK Hynix has partnered with Taiwanese chip maker TSMC to produce next-gen HBM4 memory.