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The Latest Breaking News from AnandTech

Intel Teases Lunar Lake CPU Ahead of Computex: Most Power Efficient x86 Chip Yet

The next few weeks in the PC industry are going to come fast and furious. Between today and mid-June are multiple conferences and trade-shows, including Microsoft Build and the king of PC trade shows: Computex Taiwan. With all three PC CPU vendors set to present, there’s a lot going on,…

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Lenovo Unveils Yoga Slim 7x 14 Gen 14 and ThinkPad T14 Gen 6 Notebooks Powered By Qualcomm Snapdragon X Elite

While we've been expecting the availability of the Qualcomm Snapdragon X Elite processor to be around the middle of this year, Lenovo has announced two new 'AI-powered' notebooks for the Windows on Arm platform. Announced is the Lenovo Yoga Slim 7x Gen 14 and the Lenovo ThinkPad T14s Gen 6…

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TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry

Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how…

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Capsule Review: Sunon Maglev 120mm Fan

Founded in 1980 and headquartered in Taiwan, Sunon (aka Sunonwealth Electric Machine Industry Co., Ltd.), stands out as a prominent global producer of fans, blowers, and thermal management systems. The company has made a name for itself in the fan industry with a comprehensive product line that includes DC brushless…

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Not Dead Yet: WD Releases New 6TB 2.5-Inch External Hard Drives - First Upgrade in Seven Years

UPDATE 5/17, 6 PM: Western Digital has confirmed that the new 2.5-inch T GB HDDs uses 6 SMR platters The vast majority of laptops nowadays use solid-state drives, which is why the development of new, higher-capacity 2.5-inch hard drives has all but come to a halt. Or rather, it almost…

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TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node

With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects…

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The Arctic Cooling Freezer 36 ARGB CPU Cooler Review: Budget Cooling Done Well

As modern high-performance CPUs generate more heat, there's been a noticeable increase in the demand for powerful air coolers capable of managing these thermal challenges. Traditional stock air coolers, while sufficient for regular use, are typically designed to be cheap and relatively compact, leaving further improvements to noise control and…

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TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are…

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TSMC: Performance-Optimized 3nm N3P Process on Track for Mass Production This Year

As part of the second leg of TSMC's spring technology symposium series, the company offered an update on the state of its 3nm-class processes, both current and future. Building on the back of their current-generation N3E process, the optical shrink of this process technology, N3P, is now on track to…

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Supermicro E102-13R-H Review: A Raptor Lake-P 3.5-inch SBC System for Embedded Applications

Single-board computers in the 3.5-inch form-factor have become extremely popular for embedded applications involving a mix of high performance requirements as well as extended peripherals support. Typical use-case scenarios include digital signage, edge inferencing solutions, retail applications, and IoT gateways. The requirements in these segments call for processors and components…

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Intel Core i9-14900KS Review: The Swan Song of Raptor Lake With A Super Fast 6.2 GHz Turbo

For numerous generations of their desktop processor releases, Intel has made available a selection of high-performance special edition "KS" CPUs that add a little extra compared to their flagship chip. With a lot of interest, primarily from the enthusiasts looking for the fastest processors, Intel's latest Core i9-14900KS represents a…

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AMD Hits Record High Share in x86 Desktops and Servers in Q1 2024

Coming out of the dark times that preceded the launch of AMD's Zen CPU architecture in 2017, to say that AMD has turned things around on the back of Zen would be an understatement. Ever since AMD launched its first Zen-based Ryzen and EPYC processors for client and server computers,…

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Sabrent Launches Rocket Nano M.2-2242 SSD: Up to 5 GB/sec

Sabrent tends to get into news when it launches ultra-high-performance SSDs for enthusiast-grade desktops, but this week the company introduced a completely different type of product: a small form-factor M.2-2242 SSD aimed at Lenovo's Legion Go handheld and ultra-thin laptops that don't accomodate M.2-2280 drives. And even though it's not…

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Micron Ships Crucial-Branded LPCAMM2 Memory Modules: 64GB of LPDDR5X For $330

As LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2 memory modules under their in-house Crucial brand, making them available on the latter's storefront. Timed to coincide with the release of…

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ASUS to Unveil First Qualcomm Snapdragon X Elite-Based Laptop On May 20th

Asus on Tuesday said that it would announce its first 'AI PC' based on Qualcomm's Snapdragon X Elite system-on-chips later this month. The new laptop is set to be introduced at the Next Level. AI Incredible virtual launch event on May 20. The launch of Asustek's new Vivobook S 15…

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Apple Announces M4 SoC: Latest and Greatest Starts on 2024 iPad Pro

Setting things up for what is certainly to be an exciting next few months in the world of CPUs and SoCs, Apple this morning has announced their next-generation M-series chip, the M4. Introduced just over six months after the M3 and the associated 2023 Apple MacBook family, the M4 is…

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VESA Rolls Out DisplayHDR 1.2 Spec: Adding Color Accuracy, Black Crush, & Wide-Color Gamuts For All

VESA this morning is taking the wraps off of the next iteration of its DisplayHDR monitor certification standard, DisplayHDR 1.2. Designed to raise the bar on display quality, the updated DisplayHDR conformance test suite imposes new luminance, color gamut, and color accuracy requirements that extend across the entire spectrum of…

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Samsung Tapes Out Its First 3nm Smartphone SoC, Gets A Boost From Synopsys AI-Enabled Tools

This week Samsung Electronics and Synopsys announced that Samsung has taped out its first mobile system-on-chip on Samsung Foundry's 3nm gate-all-around (GAA) process technology. The announcement, coming from electronic design automation Synopsys, further notes that Samsung used the Synopsys.ai EDA suite to place-n-route the layout and verify design of the…

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SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out

Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix this week is very publicly announcing that the company's high-bandwidth memory (HBM) production capacity has already sold out for the rest…

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The XPG Core Reactor II VE 850W PSU Review: Our First ATX 3.1 Power Supply

Just over 18 months ago, Intel launched their significantly revised ATX v3.0 power supply standard, and with it, the 600 Watt-capable 12VHPWR cable to power video cards and other high-drain add-in cards. The release of the standard came with a lot of fanfare and excitement – the industry was preparing…

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AMD Zen 5 Status Report: EPYC "Turin" Is Sampling, Silicon Looking Great

As part of AMD's Q1'2024 earnings announcement this week, the company is offering a brief status update on some of their future products set to launch later this year. Most important among these is an update on their Zen 5 CPU architecture, which is expected to launch for both client…

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PCI-SIG Completes CopprLink Cabling Standard: PCIe 5.0 & 6.0 Get Wired

The PCI-SIG sends word over this morning that the special interest group has completed their development efforts on the group’s new PCI-Express cabling standard, CopprLink. Designed to go hand-in-hand with PCIe 5.0 and PCIe 6.0, CopprLink defines both internal and external copper cabling for the latest PCIe standards, giving system…

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Samsung Foundry Update: 2nm Unveil in June, Second-Gen SF3 3nm Hits Production This Year

As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that it remains on track to meeting its goal of starting mass production of chips on its SF3 (3 nm-class, 2nd Generation)…

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TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today's

TSMC is no stranger to building big chips. Besides the ~800mm2 reticle limit of their normal logic processes, the company already produces even larger chips by fitting multiple dies on to a single silicon interposer, using their chip-on-wafer-on-substrate (CoWoS) technology. But even with current-gen CoWoS allowing for interposers up to…

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In Light of Stability Concerns, Intel Issues Request to Motherboards Vendors to Actually Follow Stock Power Settings

Across the internet, from online forums such as Reddit to various other tech media outlets, there's a lot of furor around reports of Intel's top-end 14th and 13th Gen K series of processors running into stability issues. As Intel's flagship chips, these parts come aggressively clocked in order to maximize…

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