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The Latest Breaking News from AnandTech

The AlphaCool Core Ocean T38 360mm AIO CPU Cooler Review: Loud and Proud

While the all-in-one CPU cooler industry is dominated, at least in mindshare, by flagship coolers from the industry’s biggest brands, the market segment overall has grown over the years to cover a much larger gamut of users. From flagship coolers to sub-$100 specials, effective AIO coolers have become available and…

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TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect

Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth requirements needed to keep up with (and keep scaling out) system performance, copper signaling alone won't be enough to keep up.…

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TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips

TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have fantastic performance and power efficiency, wafer-scale processors are extremely complex to develop and produce. But TSMC believes that not only will…

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TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction

While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature and proven process technologies for years to come. Which is why TSMC has continued to refine its existing nodes, including its…

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TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells

Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC's 2 nm plans remain largely unchanged: the company is on track to start volume production of chips on it's first-generation GAAFET N2 node in the…

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TSMC's 1.6nm Technology Announced for Late 2026: A16 with "Super Power Rail" Backside Power

With the arrival of spring comes showers, flowers, and in the technology industry, TSMC's annual technology symposium series. With customers spread all around the world, the Taiwanese pure play foundry has adopted an interesting strategy for updating its customers on its fab plans, holding a series of symposiums from Silicon…

AnandTech

Report: Seagate, Western Digital Hike HDD Prices Amid Surge In Demand

Seagate Technology has reportedly notified its customers abouts its plans to raise prices on new hard drive orders and for demands that exceed prior agreements, echoing a similar move by Western Digital, which increased its prices earlier this month. These changes come in response to a surge in demand for…

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Qualcomm Intros Snapdragon X Plus, Details Complete Snapdragon X Launch Day Chip Stack

As Qualcomm prepares for the mid-year launch of their forthcoming Snapdragon X SoCs for PCs, and the eagerly anticipated Oryon CPU cores within, the company is finally shoring up their official product plans, and releasing some additional technical details in the process. Thus far the company has been demonstrating their…

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Seagate: Mozaic 3+ HAMR Hard Drives Can Last Over Seven Years

As Seagate ramps up shipments of its new heat assisted magnetic recording (HAMR)-based Mozaic 3+ hard drive platform, the company is both in the enviable position of shipping the first major new hard drive technology in a decade, and the much less enviable position of proving the reliability of the…

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Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND

Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using a triple-level cell (TLC) architecture, with data transfer rates as high as 3.2 GT/s. The new 3D TLC NAND memory will…

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Lexar SL500 Portable SSD Review: Silicon Motion SM2320 and YMTC NAND in a Potent Package

Lexar has a long history of serving the flash-based consumer storage market in the form of SSDs, memory cards, and USB flash drives. After having started out as a Micron brand, the company was acquired by Longsys which has diversified its product lineup with regular introduction of new products. Recently,…

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The Eurocom 780W AC Power Adapter Review: Big Power For Big Laptops

While desktop PC power supplies receive the bulk of enthusiasts’ attention for good reasons – not the least of which being the vast selection of options that comes from being a standardized part – power supplies as a whole aren’t just a concern for big PCs. With the majority of…

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JEDEC Extends DDR5 Memory Specification to 8800 MT/s, Adds Anti-Rowhammer Features

When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s, while leaving the spec open to further expansions with faster memory as technology progressed. Now, a bit more than three-and-a-half years later, and…

AnandTech

SK Hynix and TSMC Team Up for HBM4 Development

SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth…

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TSMC Posts Q1'24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises

Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for the quarter, which is up 12.9% year-over-year, but a decline of 3.8% quarter-over-quarter. The company says that in increase in demand…

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ASML Patterns First Wafer Using High-NA EUV Tool, Ships Second High-NA Scanner

This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype system at its fab in Veldhoven, the Netherlands, has printed the first 10nm patterns, which is a major milestone for ASML…

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Intel and Sandia National Labs Roll Out 1.15B Neuron “Hala Point” Neuromorphic Research System

While neuromorphic computing remains under research for the time being, efforts into the field have continued to grow over the years, as have the capabilities of the specialty chips that have been developed for this research. Following those lines, this morning Intel and Sandia National Laboratories are celebrating the deployment…

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Samsung Unveils 10.7Gbps LPDDR5X Memory - The Fastest Yet

Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated to offer 25% better performance and 30% greater capacity compared to existing mobile DRAM devices from the company. The new chips…

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The Iceberg Thermal IceFLOE Oasis 360mm AIO Cooler Review: Affordable & Effective Cooling

Iceberg Thermal Inc. is one of the newer players in the PC cooling market. The company was founded in 2019 by an experienced team of designers and engineers setting off on their own, aiming to deliver a wide range of PC cooling products to industrial and commercial users alike. They…

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Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas

Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas. This is the third major award under the act in the last month, with all three leading-edge fabs – Intel, TSMC,…

AnandTech

NVIDIA Intros RTX A1000 and A400: Entry-Level ProViz Cards Get Ray Tracing

With NVIDIA’s Turing architecture turning six years old this year, the company has been retiring many of the remaining Turing products from its video card lineup. And today that spirit of spring cleaning is coming to the entry-level segment of NVIDIA’s professional visualization lineup, where NVIDIA is introducing a pair…

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SK hynix Tube T31 Stick SSD Review: Bridging Solution Springs A Surprise

SK hynix is one of the few vertically integrated manufacturers in the flash-based storage market. The company is well-established in the OEM market. A few years back, they also started exploring direct end-user products. Internal SSDs (starting with the Gold S31 and Gold P31) were the first out of the…

AnandTech

Corsair Enters Workstation Memory Market with WS Series XMP/EXPO DDR5 RDIMMs

Corsair has introduced a family of registered memory modules with ECC that are designed for AMD's Ryzen Threadripper 7000 and Intel's Xeon W-2400/3400-series processors. The new Corsair WS DDR5 RDIMMs with AMD EXPO and Intel XMP 3.0 profiles will be available in kits of up to 256 GB capacity and…

AnandTech

Western Digital Previews 4 TB SD Card: World's Highest-Capacity

Western Digital this week is previewing the industry's first 4 TB SD card. The device is being showcased at the NAB trade show for broadcasters and content creators and will be released commercially in 2025. Western Digital's SanDisk Extreme Pro SDUC 4 TB SD card complies with the Secure Digital…

AnandTech

AMD Quietly Launches Ryzen 7 8700F and Ryzen 5 8400F Processors

AMD has recently expanded its Ryzen 8000 series by introducing the Ryzen 7 8700F and Ryzen 5 8400F processors. Initially launched in China, these chips were added to AMD's global website, signaling they are available worldwide, apparently from April 1st. Built from the recent Zen 4-based Phoenix APUs using the…

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