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The Latest Breaking News from SK Hynix

Samsung and SK hynix double down on HBM4 and CXL technologies to counter Chinese competition

Samsung showcased its advances in CXL technology at the recent Open Compute Project Global Summit, while SK hynix plans to start mass production of HBM4 in the second half of 2025.

Tom’s Hardware

Nvidia will be thrilled – Samsung’s archrival announces it has begun production of HBM3E that will be used in Blackwell Ultra GPUs

SK Hynix has begun the mass production of its 12-layer HBM3E for AI use

TechRadar

Industry considers cutting production of 3D NAND amid dropping prices

Leading memory makers may reconsider their production plans and convert NAND capacity to DRAM capacity.

Tom’s Hardware

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Micron launches 36GB HBM3E memory as it plays catch up with Samsung and SK Hynix as archrivals frantically rush towards the next big thing — HBM4 with its 16 layers, 1.65TBps bandwidth, and 48GB SKUs

Micron's 36GB HBM3E 12-high memory offers 50% more capacity, 1.2TB/s bandwidth, and 30% lower power than competitors, fueling AI innovation.

TechRadar

TSMC execs allegedly dismissed Sam Altman as ‘podcasting bro’ — OpenAI CEO made absurd requests for 36 fabs for $7 trillion

OpenAI CEO Sam Altman took a whirlwind tour of the Far East last winter, meeting with high-powered execs from companies like TSMC, Samsung, and SK hynix. However, according to a report in the New York Times this week, senior TSMC execs dubbed Sam Altman a 'podcasting bro' after the meeting(s).

Tom’s Hardware

SK hynix preps for Nvidia Blackwell Ultra and AMD Instinct MI325X with 12-Hi HBM3E

SK hynix kicks off mass production of 12-Hi HBM3E for AMD's MI 325X, Nvidia's Blackwell Ultra, other high-performance processors.

Tom’s Hardware

Stock market today: Asian markets surge higher after Wall Street takes a breather

Shares are higher in Asia after U.S. stocks edged back from their records

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Kioxia reportedly cancels October IPO plans — blames unfavorable market trends

Amid market uncertainties, Kioxia calls off the IPO set for October.

Tom’s Hardware

Samsung, SK hynix, and TSMC set to overtake Intel in revenue in Q3

While Intel continues to be one of the biggest semiconductor companies, others are catching up and even eclipsing the giant.

Tom’s Hardware

Asgard launches world's first DDR5-9600 CUDIMMs — promising DDR5-10000+ modules are on the way

Memory and storage specialist Asgard has announced new CUDIMMs rated at a blistering DDR5-9600. The China-based firm announced its new Asgard x Thor CUDIMM DDR5-9600 C44 kits on WeChat, claiming they achieve a world first for performance.

Tom’s Hardware

Whodunnit: SK Hynix rejected $374 million advanced payment from Nvidia rival to ringfence HBM stock — and instead, Samsung competitor signed $749 billion dollar deal with Nvidia

SK Hynix declined a $374 million advance from an AI accelerator firm, opting instead to supply $749 million worth of HBM to Nvidia

TechRadar

SK Hynix Platinum P41 & Haechi Heatsink review: "The read speed was higher than advertised"

The SK Hynix Platinum P41 challenges some of the best SSDs for PS5 with respectable speeds and a mammoth of a detached heatsink.

GamesRadar

Samsung and SK Hynix spend billions more on DRAM production to feed the never-ending hunger for AI servers

This could potentially be good news for PC gaming but not while the tech world loves AI.

PC Gamer

SK hynix develops 6th-gen 10nm-class DDR5 with the world's first 16Gb DRAM modules — chipmaker claims electric savings of up to 30% for data centers

SK Hynix has announced its 6th-generation DDR5 DRAM ICs on its 10 nm process node. The new modules are 11% faster and 9% more energy efficient than their predecessors.

Tom’s Hardware

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NAND Flash Maker Kioxia files for IPO at expected $10.3 billion valuation

Bain Capital hopes to raise $500 million from Kioxia's IPO, retain control over NAND flash maker.

Tom’s Hardware

Samsung to tape out first HBM4 devices later this year, sampling begins in 2025: Report

Samsung's HBM4 details leak: 10nm for DRAMs and 4nm for base dies.

AnandTech

CXL Gathers Momentum at FMS 2024

The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announced v3.0 of the CXL specifications. This was followed by CXL 3.1's introduction at Supercomputing 2023. Having…

Tom’s Hardware

SK hynix says its 3D DRAM is half as expensive to produce — credits EUV chipmaking tools

SK hynix says adopting 4F2 structures and 3D transistors will increase the cost-efficiency of EUV lithography usage in DRAM production.

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AnandTech

Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling

Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its…

TechRadar

Fastest ever graphics memory launches but still lags HBM — SK Hynix GDDR7 RAM tops 1.5Tbps and could find its way in more affordable AI GPU cards

SK Hynix says its mass production of GDDR7 will begin in Q3 and the RAM could be used in affordable AI GPU cards.

AnandTech

U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants

Under the CHIPS & Science Act, the U.S. government provided tens of billions of dollars in grants and loans to the world's leading maker of chips, such as Intel, Samsung, and TSMC, which will significantly expand the country's semiconductor production industry in the coming years. However, most chips are typically…

AnandTech

Solidigm 122 TB Enterprise QLC SSD Announced for Early 2025 Release

Solidigm's D5-P5336 61.44 TB enterprise QLC SSD released in mid-2023 has seen unprecedented demand over the last few quarters, driven by the insatiable demand for high-capacity storage in AI datacenters. Multiple vendors have recognized and started preparing products to service this demand, but Solidigm appears to have taken the lead…

Tom’s Hardware

SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.

SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.

Tom’s Hardware

Chinese companies are stockpiling HBM2E chips ahead of new U.S. export rules

Baidu, Huawei, and Tencent are stockpiling Samsung's HBM2E memory to use with their own AI processors.

Tom’s Hardware

SK hynix announces its GDDR7 memory touting 60% faster speeds, 50% improved power efficiency

SK hynix just introduced its GDDR7 graphics memory chips intended for high-performance computing, AI processing, and more. It offers significantly improved speed and power efficiency, making it suitable for the next-generation GPUs slated to arrive late 2024 and early 2025.

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