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The Latest Breaking News from TSMC

'The only way to beat China is to stay ahead of them' says US commerce secretary as she backs CHIPS investments handed out to Intel, TSMC over sanctions

"We have to run faster, out innovate them. That’s the way to win."

PC Gamer

2025 could be very different for Google and Samsung — here's why

Google and Samsung had very different years in 2024, while one succeeded and the other struggled. 2025 will look very different for both companies in a very positive way.

Android Central

'Copper’s time has run out': Nvidia, AMD and TSMC have invested millions in a startup which may hold the key to faster chip connectivity to quench AI's thirst for bytes

Nvidia, AMD and TSMC have invested millions in a startup that may hold the key to faster chip connectivity to quench AI's thirst for bytes.

TechRadar

From analysis to the latest developments in health,
read the most diverse news in one place.

US gov't set to ban Huawei intermediary Sophgo over AI chip supplies — partnership skirted US chip sanctions

U.S. to ban Sophgo, which supplied AI chiplets to Huawei, but its affiliate Bitmain avoids sanctions.

Tom’s Hardware

Micron's HBM4E heralds a new era of customized memory for AI GPUs and beyond

Micron's HBM update: HBM4 is on track for 2026. HBM4E will introduce customizable base dies for higher performance and tailored features.

Tom’s Hardware

Apple set to build a server chip to service its own AI and may have sacrificed the company's fastest ever chip to achieve this; report suggests a strategic tie-in with $850bn Broadcom

Apple is developing a server chip designed to power its AI capabilities, potentially at the cost of what would have been its fastest chip yet.

TechRadar

As Trump 2.0 looms, Taiwan’s chip industry braces for upheaval

Trump’s return casts doubt on Joe Biden’s signature initiative providing billions in funding to semiconductor firms.

Al Jazeera

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Elon Musk prioritizing humanoid robot advances, says TSMC CEO — TSMC will supply the chips if the price is right

Elon Musk is now prioritizing advances in humanoid robotics, indicates TSMC’s CC Wei.

Tom’s Hardware

New details of TSMC's next-gen N2 chip tech aren't totally stellar but could provide a roadmap for new GPUs right through to 2031

N2 is quite a bit more efficient but only a little more dense than N3.

PC Gamer

A MediaTek modem could make or break the Pixel 10 — Google can’t screw this up

The latest reports indicate that Google could be switching from Samsung to MediaTek modems — here’s what that will mean for the Pixel 10.

Android Central

Google tipped to bring MediaTek's modem for the first time through the Pixel 10 series

Google could be far away from launching the Pixel 10 series. While the series is rumored to bring in-house customized SoC, a new report also indicates a MediaTek 5G modem.

Android Central

TSMC shares deep-dive details about its cutting edge 2nm process node at IEDM 2024 — 35 percent less power or 15 percent more performance

TSMC reveals in-depth details about its N2 process technology

Tom’s Hardware

Western self-sufficiency in computer chips is just not going to happen

American microchip giant Intel is looking for a new CEO following Pat Gelsinger’s shock resignation. This represents more than just a corporate shake-up. It’s the end of an era in which one company could totally control a strategically vital American technology.

The Conversation

Intel Panther Lake samples with flagship 18A node have been powered on at eight customers — Co-CEOs dispel rumors regarding poor silicon health

Panther Lake using Intel's 18A node has powered on at eight customers indicating the node's promising health.

Tom’s Hardware

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Tom’s Hardware

Nvidia, AMD, and Intel all invest in light-based communication networks powering next-gen chips — Ayar Labs gets $155 million in funding

Large developers of CPUs and GPUs invest hundreds of millions of dollars in developing optical interconnects.

Tom’s Hardware

Huawei sticks to 7nm for latest processor as China's chip advancements stall

Huawei reportedly decided not to use its 5nm and 6nm process technologies for its latest smartphone processor.

PC Gamer

Pat Gelsinger rallies against claims some chipmakers are struggling to produce good wafers: anyone using yields as a % 'doesn't understand semiconductor yield'

It's all about the defect density.

Tom’s Hardware

Fujitsu flaunts massive 144-core Monaka Arm chip — 2nm and 5nm chiplets, 3D-stacked CPU cores over memory

Fujitsu's Monaka is a monstrous processor with four 2nm compute chiplets, 5nm SRAM, and a massive 5nm IO die. This time, without HBM memory.

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Tom’s Hardware

TSMC founder says Intel has neither a strategy nor a CEO

Founder of TSMC criticizes Intel for not developing a sophisticated strategy for AI and instead focusing on becoming a foundry

Tom’s Hardware

TSMC posts strong year-on-year revenue growth of 34% despite month-to-month slowdown — foundry pulls in $8.5B in revenue for November 2024

TSMC's strong performance is largely driven by the rapid growth and investment in artificial intelligence infrastructure.

Barchart

Qualcomm vs. Taiwan Semiconductor: Which Is the Better Chip Stock to Buy?

Both semiconductor companies reported robust growth in the most recent quarter, but one of them is the better buy for the long haul.

Tom’s Hardware

Gelsinger fires back at recent stories about 18A's poor yields, schools social media commenters on defect densities and yields

Ex-Intel CEO Gelsinger is 'very proud of the TD/18A team for the incredible work and progress they are making'

TechRadar

The iPhone 18 lineup could feature a next-generation chipset but come with a higher price tag

Apple is reportedly considering switching to 2nm chipsets with the iPhone 18 series, which are significantly more expensive than 3nm chipsets so a price hike for consumers seems possible.

Tom’s Guide

iPhone 18 Pro tipped for big price hike in 2026 — here's why

Apple is believed to be making the switch to 2nm chipsets for the iPhone 18 series and that means an increased cost for consumers.

Tom’s Hardware

Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules

Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a system-in-packages comprising 6000mm² of 3D-stacked silicon with 12 HBM modules.

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