The Latest Breaking News from ASML

Hsinchu Science Park Director discloses TSMC's plans to start 2nm Fab equipment move-in.

South Korea's president on Tuesday kicked off a visit to the Netherlands, hoping to forge a "chip alliance" between the two global semiconductor powerhouses amid growing tech tensions with China.

The total number of ASML's DUV tools in China set to reach 600 units by late 2025 to early 2026.

The Netherlands should have restricted sales of ASML's tools to China quicker, election front runner says.

Nvidia has been a beneficiary of the recent boom in AI-related products and the company’s value briefly crossed the $1 trillion mark in late-May.

These three stocks from the AI space have all pulled back from recent highs, and analysts like the odds for another leg higher from here.

Canon has recently revealed its FPA-1200NZ2C, a nanoimprint semiconductor manufacturing tool that can be used to make advanced chips. The device uses nanoimprint lithography (NIL) technology as an alternative to photolithography, and can theoretically challenge extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography tools when it comes to resolution. Unlike…

TSMC is the third chipmaker to get a U.S. waiver to supply equipment to factories in China, following Korean firms Samsung and SK hynix.

As part of Intel’s suite of hardware announcements at this year’s Intel Innovation 2023 conference, the company offered a brief update on their plans for High-NA EUV machines, which will become a cornerstone of future Intel process nodes. Following some changes in Intel’s process roadmap – in particular Intel 18A…