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The Latest Breaking News from AnandTech

AMD Unveils Ryzen Threadripper 7000 Family: 96 Core Zen 4 for Workstations and HEDT

Having just recently crossed the one-year anniversary of AMD’s first Zen 4 architecture CPUs – the Ryzen 7000 series – we’re now at the point where the final Zen 4 products are landing in place. Thus far AMD has launched consumer desktop CPUs, multiple classes of mobile CPUs, and a…

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Arm Total Design to Facilitate Development of Custom Datacenter SoCs

Arm this week introduced its Arm Total Design initiative, which is aimed at accelerating development of custom datacenter-oriented system-on-chip (SoC) designs using Neoverse Compute Subsystems (CSS). The collaborative ecosystem unites various developers in a bid to speed up time-to-market and reduce development costs of custom SoCs for AI, cloud, and…

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Qualcomm Swaps Out Arm for RISC-V for Next-Gen Google Wear OS Devices

As part of a broad collaborative agreement with Google, Qualcomm this week said that that it will be adopting the RISC-V instruction set architecture (ISA) for a future Snapdragon Wear platform. Working together, the two companies will be bootstrapping a RISC-V ecosystem for Wear OS devices, with Qualcomm providing the…

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Canon Prepares Nanoimprint Lithography Tool To Challenge EUV Scanners

Canon has recently revealed its FPA-1200NZ2C, a nanoimprint semiconductor manufacturing tool that can be used to make advanced chips. The device uses nanoimprint lithography (NIL) technology as an alternative to photolithography, and can theoretically challenge extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography tools when it comes to resolution. Unlike…

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Intel Core i9-14900K, Core i7-14700K and Core i5-14600K Review: Raptor Lake Refreshed

In what is to be the last of Intel's processor families to use the well-established Core i9, i7, i5, and i3 naming scheme, Intel has released its 14th Generation Core series of desktop processors, aptly codenamed Raptor Lake Refresh (RPL-R). Building upon the already laid foundations of the 13th Gen…

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GEEKOM Mini IT13 Review: Core i9-13900H in a 4x4 Package

The performance of ultra-compact form-factor (UCFF) desktops has improved significantly over the years, thanks to advancements in semiconductor fabrication and processor architecture. Thermal solutions suitable for these 4in. x 4in. machines have also been evolving simultaneously. As a result, vendors have been able to configure higher sustained power limits for…

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TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion

Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC's roadshow was dedicated to the next generation of the company's foundry technology. TSMC's 2 nm-class N2, N2P, and N2X process technologies are set to introduce multiple innovations, including nanosheet…

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Samsung Lines Up First Server Customer For 3nm Fabs

Although Samsung Foundry was the first contract fab to formally start mass production of chips on a 3 nm-class process, so far, the company's latest process has largely been relegated to producing tiny cryptocurrency mining chips. But it looks like things will start picking up for Samsung's foundry business soon,…

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HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface

High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1 GT/s (the original HBM) and reaching upwards of 9 GT/s with the forthcoming HBM3E. This has made for an impressive jump…

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TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips

This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better build innovative chips in an efficient and timely manner. The OIP program has grown over the years and now involves tens…

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Intel Launches Arc A580: A $179 Graphics Card for 1080p Gaming

When Intel unveiled its range of Arc A-series desktop graphics cards last year, it introduced four models: the Arc A770, Arc A750, Arc A580, and Arc A380. However, the Arc A580, which uses a cut-down ACM-G10 GPU, never reached the market for reasons that remain unclear. On Tuesday Intel finally…

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ASRock Industrial NUC BOX-N97 and GMKtec NucBox G2 Review: Contrasting Compact ADL-N Options

Intel has been maintaining a low-power / low-cost x86 microarchitecture since the introduction of the Silverthorne Atom processors in 2008. Its latest iteration, Gracemont, made its debut in the Alder Lake lineup. The hybrid processors in that family teamed up the Gracemont efficiency cores with the Golden Cove performance cores.…

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Intel to Spin-off Programmable Solutions Group as Standalone Business, Eyeing IPO in 2-3 Years

Intel this afternoon has announced that the company will be spinning off its programmable solutions group (PSG), to operate as a standalone business. The business unit, responsible for developing Intel’s Agilex, Stratix, and other FPGA products, will become a standalone entity under Intel’s corporate umbrella starting in Q1 of 2024,…

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Tenstorrent to Use Samsung’s SF4X for Quasar Low-Cost AI Chiplet

Tenstorrent this week announced that it had chosen to use Samsung's SF4X (4 nm-class) process technology for its upcoming low-cost, low-power codenamed Quasar chiplet for machine learning workloads. The chiplets will be made at Samsung's new fab near Taylor, Texas when it becomes operational in 2024. Tenstorrent's Quasar chiplet is…

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Samsung T9 Portable SSD Review: A 20 Gbps PSSD for Prosumer Workloads

Samsung's portable SSD lineup has enjoyed significant market success since the launch of the T1 back in 2015. Despite the release of the Thunderbolt-capable X5 PSSD in 2018, the company has been focusing on the mainstream market. Multiple T series drives have made it to the market over the last…

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Micron to Ship HBM3E Memory to NVIDIA in Early 2024

Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for the new RAM. Meanwhile, the company stressed that its new product has been received with great interest by the industry at…

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Micron Samples 128 GB Modules Based on 32 Gb DDR5 ICs

Micron is sampling 128 GB DDR5 memory modules, the company said at its earnings call this week. The modules are based on the company's latest single die, non-stacked 32 Gb DDR5 memory devices, which the company announced earlier this summer and which will eventually open doors for 1 TB memory…

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Crucial Unveils X9 Portable SSD: QLC for the Cost-Conscious Consumer

Crucial entered the portable SSD market relatively late, with their X6 and X8 PSSDs being the mainstay for many years. Based on QLC NAND, they were marketed for read-intensive use-cases, though the generous amount of SLC cache ended up delivering good write performance too for mainstream consumers - particularly in…

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Corsair's Dominator Titanium Memory Now Available, Unveils Plans for Beyond 8000 MT/s

Corsair has started sales of its Dominator Titanium memory modules that were formally introduced this May. The new modules bring together luxurious look, customizable design, and extreme data transfer rates of up to 8000 MT/s. Speaking of performance, the company implied that it intends to introduce Dominator Titanium with speed…

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GlobalFoundries Applies for CHIPS Money to Expand U.S. Fabs

Update 9/30: Correcting the number of companies interested in receiving support from the CHIPS fund. GlobalFoundries has applied for financial support from the U.S. CHIPS and Science Act to expand its American manufacturing sites, the company said this week. The company intends to get federal grants and investment tax credits…

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Modular LPDDR Memory Becomes A Reality: Samsung Introduces LPCAMM Memory Modules

Although Low Power DDR(LPDDR) memory has played a pivotal role in reducing PC laptop power usage, the drawback to the mobile-focused memory has always been its tight signaling and power delivery requirements. Designed to be placed close to its host CPU in order to minimize power expenditures and maximize clockspeeds,…

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Solidigm Introduces D7-P5810: 144L SLC NVMe Drive for Write-Intensive Workloads

Solidigm's datacenter SSD offerings have been clearly delineated into different categories - the D3- SATA offerings for legacy servers, the D5- QLC-based offerings (with different models offering different tradeoffs between cost and endurance), and the D7- NVMe drives for the best performance and endurance ratings. The company has been using…

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Sabrent Ships 8TB SSD for PlayStation 5: High Capacity for a High Price

Although Sony's PlayStation 5 game console fully supports off-the-shelf PCIe 4.0 solid-state drives, Sony initially limited the maximum capacity to 4 TB. Recently the company removed that cap as part of the PS5 8.00 firmware update, and now the system can support drives with up to 8 TB. Sabrent, in…

AnandTech

ECS LIVA Q3D and ACEMAGIC T8 Plus micro-PCs Review: Jasper Lake and Alder Lake-N in a Smaller-than-UCFF Package

Compact computing systems have gained significant market share over the last decade. Improvements in the performance per watt metric of processors have enabled the replacement of bulky desktop PCs by ultra-compact form-factor (UCFF) machines with a 4 in. x 4 in. footprint. Motivated by IoT applications at the edge, some…

AnandTech

Asus Launches ROG Matrix GeForce RTX 4090: All a 4090 Can Be, For $3200

When Asus teased its ROG Matrix GeForce RTX 4090 graphics card back at Computex, it was clear that the company's ambitions were to develop no less than the world's fastest graphics card. The company meticulously described the card's advanced printed circuit board design, voltage regulating module, and cooling system, but…

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