A growing body of forecasts from AMD, Nvidia, Broadcom, and major research firms now points toward a semiconductor market that passes the trillion-dollar threshold before the decade closes, driven by an AI infrastructure buildout several times larger than any previous expansion in the industry’s history.
New analysis from Creative Strategies is calling this shift a "giga cycle," arguing that the unprecedented scale of AI demand is restructuring the economics of compute, memory, networking, and storage simultaneously. Global semiconductor revenue was roughly $650 billion in 2024, yet multiple outlooks now place the trillion-dollar mark in 2028 or 2029. AI is responsible for most of that upward revision.
AMD CEO Lisa Su recently lifted the company’s own long-term expectations, describing the AI hardware market as a $1 trillion opportunity by 2030 while projecting 35% compound annual growth for AMD overall and around 60% for its data-center business. She also spoke out against AI bubble talks that have dominated in recent months.
Meanwhile, Nvidia has set even broader expectations, describing the coming five years as a $3 trillion to $4 trillion AI infrastructure opportunity during the company’s Q2 2026 earnings call. This figure is based on system-level deployments across hyperscalers, sovereign AI projects, and enterprise clusters.
The broader implication is that every major category of silicon is expanding at once. Creative Strategies expects data-processing silicon to exceed half of total semiconductor revenue by 2026. AI accelerators, which accounted for under $100 billion in 2024, are projected to reach the $300 billion to $350 billion range by 2029 or 2030. That growth pushes system spending sharply higher. The AI server market is forecast to climb from about $140 billion in 2024 to as much as $850 billion by 2030, a trajectory that will reshape chip demand even before accounting for custom silicon.
This environment has elevated ASIC development to a central role in hyperscaler roadmaps. Broadcom expects its custom-silicon business to exceed $100 billion by decade’s end. The company has already disclosed a $10 billion AI infrastructure order from a customer thought to be OpenAI.
Memory and packaging remain the tightest constraints. HBM revenue is forecast to grow from roughly $16 billion in 2024 to more than $100 billion by 2030. Each HBM generation consumes a larger share of wafer supply than conventional DRAM, pushing the broader memory market upward as AI clusters scale. Advanced packaging faces similar pressure as CoWoS capacity is projected to expand by more than 60% from the end of 2025 to the end of 2026.
"The defining characteristic of the semiconductor giga cycle is that the market expansion is large enough to create greenfield opportunities across every segment of the value chain," says Creative Strategies, presenting the combined effect as a moment where every segment is growing in unison rather than a cycle concentrated in any particular area.
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